About EPTC
The 13th Electronics Packaging Technology Conference (EPTC 2011) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.
EPTC 2011 will feature technical sessions, short courses/forums, an exhibition, social and networking activities. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.
Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in Asia and is well attended by experts in all aspects related to packaging technology from all over the world.
Conference Topics
You are invited to submit an abstract, presenting new development in the following categories:- Advanced Packaging: Wafer level packaging, 3D integration, TSV (through Silicon Via) , embedded passives & actives on substrates, flip chip packaging, RF-ID, 3D SiP, Packaging solutions for MEMS and MOEMS
- Interconnection Technologies: wire bonding technology, flip chip technology, solder alternatives (ICP, ACP, ACF, NCP), and TSV
- Materials & Processes: Materials and processes for traditional and advanced microelectronic systems, 3D packages, MEMS, solar, green and biomedical packaging
- Modeling & Simulations: Electrical modeling & signal integrity, thermal characterization & cooling solutions, mechanical modeling & structural integrity
- Quality & Reliability: Component, board and system level reliability assessment, interfacial adhesion, accelerated testing and models, advances in reliability test methods and failure analysis
- Emerging Technologies: Packaging technologies in biomedical, bioengineering, biosensors and wearable electronics
- Printed Electronics: Printed devices: transistors, batteries and memory, large area printed functional films: lighting, sensors and photovoltaics, solution processing of organic and inorganic materials
- Wafer/Package Testing and Characterization: Highspeed test architectures and systems, test methodologies, probe card design
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