Welcome to EPTC 2010
Technical Committee
Advanced Packaging
- Category Chair
- Kripesh VAIDYANATHAN, Institute of Microelectronics, Singapore
- Category Co-chair
- Chin Hui CHONG, Micron Semiconductor Asia Pte Ltd , Singapore
- Members
- Ramam AKKIPEDDI, Institute of Materials Research & Engineering, Singapore
- Rolf ASCHENBRENNER, Fraunhofer IZM, Germany
- Xavier BARATON, STMicroelectronics, Singapore
- Charles BAUER, TechLead Corporation, USA
- Kai Chong CHAN, GLOBALFOUNDRIES, Singapore
- Rajen CHANCHANI, Sandia National Laboratories, USA
- Jean-Christophe ELOY, Yole Development, France
- Vetrivel Periyaswamy GANESH, Infineon Technologies, Singapore
- Erik JUNG, Fraunhofer IZM, Germany
- Werner KRONIGER, Infineon Technologies, Germany
- Aditya Kumar, Global Foundries, Singapore
- Thiam Beng LIM, Semicon Fine Wire, Singapore
- Jian Min MIAO, Nanyang Technological University, Singapore
- Khan Navas, Institute of Microelectronics, Singapore
- Martin OPPERMANN, Technische Universitat Dresden, Germany
- Gaurav SHARMA, Institute of Microelectronics, Singapore
- Jean-Charles SOURIAU, LETI, France
- Vempati SRINIVAS, Institute of Microelectronics, Singapore
- Denis SWEATMAN, Griffiths University, Australia
- Victor TAN, ASE, Singapore
- Jan VARDAMAN, Tech Search, USA
- Juergen WOLF, Fraunhofer IZM, Germany
- Li-Rong ZHENG, Royal Institute of Technology (KTH), Sweden
Electrical Modeling & Signal Integrity
- Category Chair
- Yongxin GUO, National University of Singapore, Singapore
- Category Co-chair
- Masahiro AOYAGI, AIST Japan, Japan
- Members
- Flavio CANAVERO, Politecnico di Torino, Italy
- A. Ege ENGIN, San Diego State University, United States
- Toshio SUDO, Shibaura Institute of Technology, Japan
- Brian YOUNG, Texas Instruments, United States
Emerging Technologies
- Category Chair
- CS PREMACHANDRAN, Globalfoundries Singapore, Singapore
- Category Co-chair
- Martin OPPERMANN, Technische Universitat Dresden, Germany
- Members
- Ramam AKKIPEDDI, Institute of Materials Research & Engineering, Singapore
- A. ALPHONES, Nanyang Technological University, Singapore
- Won Kyoung CHOI, STATS ChipPAC, Singapore
- Jacques DOUCERAIN, STMicroelectronics, Singapore
- Rosalind LUI, TSEA International, Singapore
- Jian Min MIAO, Nanyang Technological University, Singapore
- Jim MORRIS, Portland University, United States
- Martin OPPERMANN, Technische Universitat Dresden, Germany
- Nga Phuong PHAM, IMEC, Belgium
- C. S. PREMACHANDRAN, Globalfoundries Singapore, Singapore
- Wolfgang REINERT, Fraunhofer Institute for Silicon Technology, Germany
- Denis SWEATMAN, Griffiths University, Australia
- Kiat Choon TEO, Delphi, Singapore
- Jun WEI, Institute of Manufacturing Technology, Singapore
- Stephen WONG, Singapore Institute of Manufacturing Technology, Singapore
- Ling XIE, Institute of Microelectronics, Singapore
Interconnection Technologies
- Category Chair
- Poi Siong TEO, Infineon Technologies Asia Pacific, Singapore
- Category Co-chair
- Hong Meng HO, Semicon Fine Wire Pte Ltd, Singapore
- Members
- Horst CLAUBERG, KnS, United States
- Wei FAN, Singapore Institute of Manufacturing Technology, Singapore
- Wei FAN, Singapore Institute of Manufacturing Technology, Singapore
- James HOW, , Singapore
- David HUTT, Loughborough University, United Kingdom
- In Soo KANG, Nepes Corporation, Korea
- John LAU, ITRI, Taiwan
- Yew Cheong MUI, Advanced Micro Devices, Singapore
- Kyung Wook PAIK, KAIST, Korea
- Nga Phuong PHAM, IMEC, Belgium
- Paul SIBLERUD, ElectroChemical Deposition Semitool, United States
- Mohandass SIVAKUMAR, ASM Technology, Singapore
- Ai Min TAN, Infineon Technologies Asia Pacific, Singapore
- Teck Tiong TAN, STATS ChipPAC, Singapore
- Chee Wei TOK, Heraeus Holding, Singapore
- King Ning TU, UCLA, United States
Materials & Processes
- Category Chair
- Kaiyang ZENG, National University of Singapore, Singapore
- Category Co-chair
- Ji Sheng PAN, Institute of Materials Research and Engineering, Singapore
- Members
- Choong Kooi CHEE, Intel Malaysia, Malaysia
- Fu GUO, Beijing University of Technology, China
- Hwa-Teng LEE, National Cheng Kung University, Taiwan
- Guoyuan LI, South China University of Technology, China
- Changqing LIU, Loughborough University, UK
- Cheng-Yi LIU, National Central University, Taiwan
- Young-Bae PARK, Andong National University, South Korea
- Mervi PAULASTO-KRÖCKEL , Helsinki University of Technology, Finland
- Ee Hua WONG, Singapore Institute of Manufacturing Technology, Singapore
- Kejun ZENG, Texas Instruments Inc., USA
Mechanical Modeling & Structural Integrity
- Category Chair
- Andrew TAY, National University of Singapore, Singapore
- Category Co-chair
- Xiaowu ZHANG, Institute of Microelectronics, Singapore
- Members
- Azhar ARIPIN, On Semiconductor, Malaysia
- Juergen AUERSPERG, IZM, Germany
- Chris BAILEY, University of Greenwich, United Kingdom
- Kuo Ning CHIANG, National Tsing Hua University, Taiwan
- Leo ERNST, Delft University of Technology, The Netherlands
- Shan GAO, The Institute of Microelectronics, Singapore
- Steve GROOTHUIS, SimuTech Group , United States
- Kian Ming LIM, National University of Singapore, Singapore
- Yong LIU, Fairchild, United States
- Noriyuki MIYAZAKI, Kyoto University, Japan
- Suresh SITARAMAN, Georgia Institute of Technology, United States
- Ganesh SUBBARAYAN, Purdue University, United States
- Ephraim SUHIR, UCSC, United States
- Chang Lin YEH, ASE, Taiwan
- Qiang YU, Yokohama National University, Japan
- Matthew YUEN, HKUST, Hong Kong, China
- C. Q. ZHANG, NXP, The Netherlands
- Xueren ZHANG, UTAC, Singapore
- Jenny ZHOU, Lamar University , United States
- Wei ZHOU, Micron, Singapore
Printed Electronics
- Category Chair
- Subodh MHAISALKAR, Nanyang Technological University, Singapore
- Category Co-chair
- Florian DOETZ , BASF, Singapore
- Members
- Pooi See LEE, Nanyang Technological University, Singapore
- Eric OU, Bayer Material Science, Singapore
Quality & Reliability
- Category Chair
- Vincent TAN, National University of Singapore, Singapore
- Category Co-chair
- Tai Chong CHAI, Institute of Microelectronics, Singapore
- Members
- Masazumi AMAGAI, Texas Instruments, Japan
- Christian BIRZER, Infineon Technologies, Germany
- JF Jo CAERS, Philips Applied Technologies, The Netherlands
- Xuejun FAN, Lamar University , United States
- Yi-Shao LAI, ASE, Taiwan
- Tinyu Leon LIN, Motorola, Singapore
- Stefano MARIANI, Politecnico di Milano, Italy
- Keith NEWMAN, Oracle, United States
- Hong Wan NG, Micron, Singapore
- Alfred YEO, Chartered Semiconductor Singapore, Singapore
Thermal Characterization & Cooling Solutions
- Category Chair
- Shan GAO, Institute of Microelectronics, Singapore
- Category Co-chair
- Kok Chuan TOH, Temasek Laboratories @ NTU, Singapore
- Members
- Avram BAR-COHEN, University of Maryland, United States
- Kok Fah CHOO, Temasek Laboratories @ NTU, Singapore
- Yong Sheng CHUA, DSO National Laboratories, Singapore
- Bernard COURTOIS, TIMA, France
- Suresh GARIMELLA, Purdue University, United States
- Yogendra JOSHI, Georgia Institute of Technology, United States
- Poh Seng LEE, National University of Singapore, Singapore
- Baomin LIU, Advanced Micro Devices, United States
- Wataru NAKAYAMA, Therm Tech International, Japan
- Khan NAVAS, Institute of Microelectronics, Singapore
- Damaruganath PINJALA, Institute of Microelectronics, Singapore
- Marta RENCZ, MicReD, Hungary
- Sandeep TONAPI, Anveshak , United States
Wafer/Package Testing and Characterization
- Category Chair
- Bruce KIM, The University of Alabama, United States
- Category Co-chair
- Enxiao LIU, Institute of High Performance Computing, Singapore
- Members
- W. L. CHONG , Advanced Micro Devices, Singapore
- Sungho KANG, Yonsei University, Korea
- Sung Ju PARK, Hanyang University, Korea
- Yervant ZORIAN, Virage Logic, United States