Short Courses - Wednesday, 8 December 2010
Participants need to register for one morning and one afternoon Short Courses.
| Morning Session - 8.30 am to 12.30 pm | |
| Short Course SC1 | |
| Speaker: | Ahmer SYED, Amkor |
| Title: | Package and Board Level Reliability Part 1-Accelerated Testing and Design for Reliability |
| Short Course SC2 | |
| Speaker: | Eric PERFECTO, IBM |
| Title: | Flip Chip Fabrication and Interconnection |
| Short Course SC5 | |
| Speaker: | Bruce C. KIM, The University of Alabama |
| Title: | Electrical Test Strategies for High-Density Package |
| Afternoon Session - 13.30 pm to 17.30 pm | |
| Short Course SC3 | |
| Speaker: | Ahmer SYED, Amkor |
| Title: | Package and Board Level Reliability Part 2-Finite Element Simulations for Failure Prediction |
| Short Course SC4 | |
| Speaker: | John H. LAU, ITRI |
| Title: | 3D IC/Si Integrations and WLP |
| Short Course SC6 | |
| Speaker: | Siegfried GOERLICH and Ming XUE, Infineon |
| Title: | Advanced Failure Analysis of Semiconductor Packaging |