Materials & Processes: Materials and processes for traditional and advanced
microelectronic systems, 3D packages, MEMS, solar, green and biomedical packaging
Quality & Reliability: Component, board and system level reliability assessment,
interfacial adhesion, accelerated testing and models, advances in reliability test methods and failure analysis
Emerging Technologies: Packaging technologies in biomedical, bioengineering,
biosensors and wearable electronics
Printed Electronics: Printed devices: transistors, batteries and memory, large area
printed functional films: lighting, sensors and photovoltaics, solution processing of organic and inorganic
materials
Wafer/Package Testing and Characterization: Highspeed test architectures and
systems, test methodologies, probe card design