CONFERENCE TOPICS
You are invited to submit an abstract presenting new development in the following categories:
Advanced Packaging & Emerging Technologies
Wafer level packaging, 3D integration, embedded passives & actives on substrates, high power modules, high pin count flip chip packaging, RF-ID, SiP and other system integration technologies. Packaging solutions for MEMS, Bio-electronics, Automotive electronics, optoelectronics, organic and printable electronics.
Interconnection Technologies
Gold and copper wire bonding and flip chip (eutectic/lead-free solders) on standard and copper low-k wafers, solder replacement flip chip (ICP, ACP, ACF, NCP), under bump metallurgy, 3D and through Si via connections, microvia and build-up technologies, fine pitch interconnects, nano interconnects.
Manufacturing Technologies
Sustainable volume production of advanced packages and emerging technologies. New manufacturing technologies focusing on incorporating rapid product changes, cost, yield improvement, electrical/mechanical and environmental performance.
Materials & Processes
Advancements in adhesives, encapsulants, underfills, solder alloys, ROHS compliant materials, flexible dielectrics, ceramics, composites, thin film processes on laminates, nano-materials and assembly processes, advanced material characterization techniques.
Electrical Modeling & Signal Integrity
Modeling simulation & measurement for coupling, signal Integrity, power integrity & decoupling scheme analysis reflection, switching noise, EMI/EMC analysis on package & subsystems, RF modules, time & frequency domain measurements for advanced modules.
Thermal Characterization & Cooling Solutions
Modeling & simulation methodology for thermal characterization of advanced packaging, modules & systems. Novel thermal management solutions. Enhanced air & liquid cooling techniques, Hot-spot management.
Mechanical Modeling & Structural Integrity
Thermo-mechanical modeling at package, board & system levels. Modeling of delamination, moisture diffusion, hygrostress, thermal cycling, drop impact, bend, vibration, solder joint reliability and life prediction, measurement of material & interface properties, experimental verification.
Quality & Reliability
Component, board and system level reliability assessment, interfacial adhesion, accelerated testing and models, advances in reliability test methods and failure analysis.