ABOUT EPTC
The 10th Electronics Packaging Technology Conference (EPTC 2008) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter, sponsored by IEEE CPMT Society.
EPTC 2008 is a 4-day event, will feature technical sessions, short courses and exhibition. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.
Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in Asia and is well attended by experts in all aspects related to packaging technology from all over the world.
CONFERENCE TOPICS
You are invited to submit an abstract presenting new development in the following categories:
- Advanced Packaging & Emerging Technologies
- Interconnection Technologies
- Manufacturing Technologies
- Materials & Processes
- Electrical Modeling & Signal Integrity
- Thermal Characterization & Cooling Solutions
- Mechanical Modeling & Structural Integrity
- Quality & Reliability
Call for Short Courses
The conference program includes half and full-day short courses which will be conducted by leading experts in the field. Details will be updated in the conference website and available in subsequent mailings. Proposals for short courses can be submitted to .
Call for Exhibition / Sponsorship
A tabletop exhibition featuring suppliers of materials, equipment, components, software and service providers of the microelectronics and electronic assembly industries will be held during the conference. Potential exhibitors and sponsors may email for details.